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MG Chemicals Cold Solder Solid Adhesive, 21 g
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Technical Specifications
Adhesive Type
Conductive Epoxy Adhesive
Trade Name
Cold Solder
Application
Thermal Management
Material Compatibility
Metal, Plastic
Product Form
Solid
Package Type
Syringe
Package Size
21 g
Cure Time
1 h
Viscosity Description
High Viscosity
Maximum Operating Temperature
+150°C
Specific Gravity
3.56
Minimum Operating Temperature
-40°C
Operating Temperature Range
-40 → +150 °C
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