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Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm
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Technical Specifications
Dimensions
25.4 x 19mm
Thickness
0.152mm
Length
25.4mm
Width
19mm
Thermal Conductivity
0.9W/m·K
Material
Thin Film Polyimide
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+180°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad K4
Operating Temperature Range
-60 → +180 °C
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