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Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 11.1 x 7.92mm
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Technical Specifications
Dimensions
11.1 x 7.92mm
Thickness
0.152mm
Length
11.1mm
Width
7.92mm
Thermal Conductivity
1.3W/m·K
Material
Thin Film Polyimide
Self-Adhesive
Yes
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+180°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad K10
Operating Temperature Range
-60 → +180 °C
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