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Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm
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Technical Specifications
Dimensions
25 x 19mm
Thickness
0.127mm
Length
25mm
Width
19mm
Thermal Conductivity
0.5W/m·K
Material
Hi-Flow 625
Self-Adhesive
Yes
Minimum Operating Temperature
-30°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 625
Operating Temperature Range
-30 → +150 °C
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